May Issue of SMT007 Magazine: Coming to Terms With AI
In the May 2024 issue of SMT007 Magazine, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and...
New Yorker, Major League Electronics Sign New Franchised Distribution Agreement
New Yorker Electronics, global distributor of electronic components, recently announced a new franchised distribution agreement with Major League...
OSI Systems President and CEO Deepak Chopra to Retire by Calendar Year-End, Will Remain as Executive Chairman
OSI Systems, Inc. announced today that Chairman and Chief Executive Officer Deepak Chopra has informed the Company’s Board of Directors of his...
DDM Novastar Unveils Affordable NovaPlace Automatic Pick and Place Systems
DDM Novastar, a prominent U.S. manufacturer specializing in SMT and PCB assembly equipment, proudly announces the recent launch of their NovaPlace...
Governor of Virginia Visits Zollner
In the course of our business activities with Virginia Economic Development and the recent investments made in Leesburg and Danville, a visit with personal exchange followed on April 30,...
Kimball Electronics Mexico Partners with Municipality for Green Community Project
Kimball Electronics Mexico recently participated in a valuable Green Community Project, demonstrating their commitment to environmental...
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Real Time with…. IPC APEX EXPO 2024: Innovation and Collaboration at EPTAC
May 6, 2024 | Real Time with...IPC APEX EXPO
Guest Editor Kelly Dack and EPTAC Vice President Leo Lambert discuss the partnership between EPTAC and Blackfox, their program alignment, and future expansion plans. Leo introduces Burak Gokmen as the new "leader of the pack." The focus then shifts to Nano Dimensions' 3D printed circuit boards, emphasizing the need for proper documentation and training.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 3, 2024 | Nolan Johnson, I-Connect007
This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
MORE ARTICLES
The Knowledge Base: A CM’s Perspective on Box Build Practices
April 30, 2024 | Mike Konrad, The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic...
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
April 17, 2024 | Dr. Jennie Hwang, SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and...
Nolan’s Notes: Do More, Get More
April 2, 2024 | Nolan Johnson, Nolan's Notes
This month in SMT007 Magazine, we’re investigating box build, a manufacturing sector so closely adjacent to board assembly that some OEM customers they’re the same thing. To those of us doing this work, we know they’re very...
Global Sourcing Spotlight: Don’t Be Afraid of Global Sourcing
April 3, 2024 | Bob Duke, Global Sourcing Spotlight
On paper, it doesn’t seem like a great time for global sourcing. With several world conflicts, it may seem impossible to think that something like global sourcing and commercial trade between countries could begin to alleviate this...
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